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W80Cu20 W90Cu10 Tungsten Copper Alloy Thickness 1.0mm

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W80Cu20 W90Cu10 Tungsten Copper Alloy Thickness 1.0mm

Brand Name : FOTMA

Model Number : WCu Tablets

Certification : ISO9001:2008

Place of Origin : P.R. China

MOQ : 1 pcs

Price : Negotiable

Payment Terms : T/T, L/C, Western Union, PayPal

Supply Ability : 10000pcs/month

Delivery Time : 20-25 days after deposit

Packaging Details : Paper cartons or plywood boxes

Tungsten : 50% - 90%

Copper : 10% - 50%

Sizes : Customized

Application : LED Heat spreader parts

Surface : Blank, Ni Coated

Tolerance : +/-0.05mm

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Tablets Tungsten Copper Alloy Grade W80Cu20 W90Cu10 Thickness 0.1 - 1.0mm for LED

Tungsten copper alloy is the first choice for LED heat spreader parts. Thermal conductivity and thermal expansion characteristics of the base plate must be optimally harmonized to avoid undesired distortions to the semiconductor. The better harmonized the properties are, the better the semiconductor module is to withstand soldering processes involved during manufacture and the temperature cycles that occur during operation.


Thermal expansion characteristics of tungsten copper alloy tablets similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper’s thermal conductivity and expansion characteristics, Tungsten copper tablets works well in densely packed circuits too.

Applicatioins of Tungsten Copper Tablets:

Our tungsten copper composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide.

Advantages of Copper Tungsten Tablets:

High thermal conductivity

Strong hardness(86~93.5HRA)
High arc resistance combined with good electrical conductivity
Low thermal expansion.


Specifications of Tungsten Copper Alloy Tablets:

Material

W90Cu10

W88Cu12

W85Cu15

W80Cu20

W75Cu25

Tungsten Content (wt%)

90 ± 1

88 ± 1

85 ± 1

80 ± 1

75 ± 1

Density at 20°C (g/cm3)

17.0

16.8

16.3

15.6

14.9

Coefficient of thermal expansion at 20°C (10-6/K)

6.5

6.7

7.0

8.3

9.0

Code No.

Chemical Composition %

Mechanical properties

CU

Impurity

W

Density

(g/cm3)

Hardness

HB

RES(cm)

Conductivity

IACS/ %

TRS/ Mpa

CuW(50)

50+2.0

0.5

Balance

11.85

115

3.2

54

CuW(55)

45+

2.0

0.5

Balance

12.30

125

3.5

49

CuW(60)

40+2.0

0.5

Balance

12.75

140

3.7

47

CuW(65)

35+2.0

0.5

Balance

13.30

155

3.9

44

CuW(70)

30+2.0

0.5

Balance

13.80

175

4.1

42

790

CuW(75)

25+2.0

0.5

Balance

14.50

195

4.5

38

885

CuW(80)

20+2.0

0.5

Balance

15.15

220

5.0

34

980

CuW(85)

15+2.0

0.5

Balance

15.90

240

5.7

30

1080

CuW(90)

10+2.0

0.5

Balance

16.75

260

6.5

27

1160


Picture show:

W80Cu20 W90Cu10 Tungsten Copper Alloy Thickness 1.0mm


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